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Press-Fit

Patented ENNOVI Press-Fit Technology is a solderless interconnect system validated to meet IEC 60352-5 and IPC-9797 standards in high-stress, high-temperature applications.

Want to learn more?
Download the datasheet

How it works

  1. Compliant high normal force technology
  2. Whisker mitigation option

Applications

Addressing the need for high contact reliability and assembly-friendly contacts, our Press-Fit technology offers an alternative to electro-mechanical interconnects, with consistent contact force, reducing the risk of cold joints or poor connections that can occur with soldering. The IEC61709 standard rates Press-Fit with up to 10 times greater reliability.
  • Automotive Ethernet Connector: ENNOVI-Net
  • High-Pin-Count Solutions
  • Multi-Row Board-to-Board Connector: ENNOVI-MB2B
  • Power Busbar PCB Connector: ENNOVI-BusMate
  • Radar Interconnect

Battery systems in cars, buses, trucks, subway systems, motorcycles, bicycles, and maritime vessels.

Solder strength without solder issues

ENNOVI Press-Fit components offer highly repeatable, RoHS-compliant solderless assembly. With unmatched electrical and mechanical characteristics, they avoid quality problems associated with solder, such as cold spots, voids, splatter, and cracks.

Performs in high temperatures

High normal force interface enables movement to accommodate CTE mismatch, providing excellent performance during high-temperature cycling conditions.

Repeatable. Reliable.

Press-Fit offers strong, solder-free, repeatable, and highly reliable interfaces with high normal forces.

Whisker mitigation

We offer IndiCoat™ whisker mitigation electroplating technology as a finishing option for all Press-Fit components.

Technical specifications

  • Technical literature
  • Press-Fit types
  • Off-the-shelf Press-Fit types

Datasheet

Download datasheet
PRODUCT FAMILY PRESS-FIT TYPE PICTURE FINISHED PCB HOLE DIAMETER (mm) INSERTION FORCE1 PUSH-OUT FORCE1,2
Mini
0.4 miniPLX

Ø0.55 – 0.65
≤ 100 N
≥ 15 N
Mini
0.4 miniEON

Ø0.55 – 0.65
≤ 70 N
≥ 15 N
Signal
0.4 EON

Ø0.75 – 0.83
≤ 70 N
≥ 15 N
Signal
0.64 EON

Ø1.0 – 1.1
≤ 100 N
≥ 30 N
Power
0.8 EON

Ø1.45 – 1.55
≤ 180 N
≥ 60 N
High Power
1.2 EON

Ø2.0 – 2.1
≤ 180 N
≥ 60 N
1 Sn plated Press-Fit, Imm. Sn PCB of thickness ≥1.6 mm

2 After storage at room temperature for ≥24 hours

*ALL SPECIFICATION VALUES INDICATED HEREIN ARE WITHIN TYPICAL VALUE RANGE; ACTUAL SPECIFICATIONS DEPEND ON END APPLICATIONS AND REQUIREMENTS
PRODUCT FAMILY PRESS-FIT TYPE PICTURE P/N MATERIAL DIMENSION (T/W/L IN mm) PITCH (mm) 2D DRAWING 3D DRAWING
Signal
0.64 EON
IA6530
C19010 R580
0.64 x 1.6 x 9.6
3
Download
IA6530
Download
IA6530
Signal
0.64 EON
IA6521
C19010 R580
0.63 x 0.63 x 16.7
2.54
Download
IA6521
Download
IA6521
Signal
0.64 EON
IA6522
C19010 R580
0.63 x 1.5 x 16.8
3.1
Download
IA6522
Download
IA6522
Power
0.8 EON
IA6523
C19010 R580
0.8 x 2.8 x 18.25
5
Download
IA6523
Download
IA6523
Power
0.8 EON
IA6524
C19010 R580
0.8 x 6.0 x 17.95
7.5
Download
IA6524
Download
IA6524
Power
0.8 EON
IA6525
C19010 R580
0.8 x 11 x 24.2
15
Download
IA6525
Download
IA6525
1 Sn plated Press-Fit, Imm. Sn PCB of thickness ≥1.6 mm

2 After storage at room temperature for ≥24 hours

*ALL SPECIFICATION VALUES INDICATED HEREIN ARE WITHIN TYPICAL VALUE RANGE; ACTUAL SPECIFICATIONS DEPEND ON END APPLICATIONS AND REQUIREMENTS

The solder-free alternative

Designed for reliability and assembly-friendly contacts, ENNOVI Press-Fit technology provides a high-endurance, highly flexible electro-mechanical interconnect system without the need for solder.
Types of Press-Fit technology:
  • Vertical/angled Press-Fit pins for line-to-board connections
  • Dual-ended Press-Fit pins for parallel board-to-board connections
  • Press-Fit with IDC for blade- or wire-to-board connections.
  • ENNOVI-BusMate for high current board-to-board and busbar-to-board connections.
  • SMT Card Edge Contact System for right-angle/perpendicular daughterboard-to-motherboard connections

Press-Fit pin

Compliant eye-of-the-needle Press-Fit technology with high normal force

Have questions about this solution?

Speak with us.

6 steps to innovation

Here’s how we’ll work together:

01

Enquire
Complete this form with your battery requirements and design, and we will be in touch with you.

02

Discover
We will first understand your use case and application.

03

Design

Optimize your design through simulation, prototyping, and innovation.

04

Propose

Create a proposal that addresses your challenges.

05

Contract
A clear program plan is set once the business has been awarded.

06

Production
Ramp up to full operations and delivery of the products to you.

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High-Pin-Count Header
CONTROLLER

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