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Photochemical etching, also known as photochemical machining (PCM), is a precise manufacturing process used to create intricate metal parts. It uses photosensitive film, also known as photoresists, and etching solutions to selectively remove metal from a workpiece to create complex and detailed designs.
Our advanced high-precision, high-volume etching processes are ideal for components that require close tolerances and high repeatability with features that are too small to achieve with conventional stamping processes.
Download the Chemical Etching Capabilities & Design Guide.
Our advanced etching processes use controlled corrosion to produce intricate, burr-free metal parts with tight tolerances, and support efficient high-volume production.
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Tight tolerances – most metal thicknesses are in the 0.002” to 0.010” range, but can range up to 0.020” when required.
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Half-etching for special applications such as hand break-offs, sharp beveled edges and tips, and capillary grooves.
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Fully computerized process control system manages 160 critical and chemical process variables in real time to assure uniform and consistent results.
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High repeatability with reel-to-reel etching.
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Low stress on materials as material is only being chemically removed.
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Burr and slag free, with ultra-fine pitches, intricate shapes and 3D feature profiles.
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Rapid time-to-market as etched parts are produced using photo masks, which reduces the need for tooling.
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Minimum feature size: 1.1x material thickness.
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Minimum thickness: 0.0008” (0.0203mm).
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Feature tolerance: 10% of material thickness.
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Positional tolerance: 1 – 3μm (0.001 – 0.003mm).
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Maximum thickness: 0.0200” (0.508mm).
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Maximum part width: 12” (300mm).
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Maximum part length: 1,000’ (300m).
Innovating Reliable Interconnects with ENNOVI's Solder Bearing Leads (SBL)
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