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Improve electrical conductivity with gold, or silver plating for low-resistance contact surfaces.
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Prevent corrosion with nickel, tin, or zinc plating for harsh environments.
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Enhance wear resistance critical for high-mating-cycle connectors.
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Provide solderability with tin or tin-lead plating for PCB terminations.
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Enable specific signal or power characteristics with gold flash for high-speed data.
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Improve aesthetics for consumer devices or decorative parts.
Backed by a strong supply chain and stable chemical sourcing, our reel-to-reel plating supports high-volume, cost-sensitive applications, while our flexible batch sizes are great for prototyping and production.
Our electrodeposition capabilities include numerous options for materials, selective coverage, and finishes.
Our in-house lab facilities support adhesion, porosity, corrosion, and solderability testing to ensure every solution meets the highest standards. With capabilities for prototyping and rapid process development, we enable faster iterations and cost-effective plating substitutions without sacrificing performance.
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