Contact us

About the On-Demand Webinar

Now available to watch on-demand, this session helps automotive engineers and product designers tackle interconnect challenges with press-fit technology– a solderless alternative to traditional methods.

Learn how press-fit connections eliminate soldering defects, boost electrical reliability, and support high-density, high-voltage designs. Gain practical insights through real-world examples to improve performance, simplify manufacturing, and lower lifecycle costs.

Key takeaways:

  • Understand key interconnect challenges: reliability, thermal stress, soldering limits
  • Discover press-fit as a high-reliability, solderless solution
  • Learn design factors: pin geometry, material selection, and assembly
  • See use cases in EVs, ADAS, and powertrain modules
  • Apply ENNOVI’s practices to improve quality and speed time-to-market

Why Watch:

Traditional soldering can’t meet modern demands. This on-demand webinar introduces press-fit as a smarter solution for reliable, high-performance automotive systems.

Watch now to:

  • Explore real-world examples
  • Leverage ENNOVI’s engineering expertise
  • Get actionable strategies for better interconnect design

Speaker’s Profile

Gigi Ling, Product Manager Gigi has 9 years of product management experience in the connector industry. Before joining ENNOVI, she held product management roles at Molex Interconnects and Flextronics in Shanghai. She holds an MBA from the University of Hong Kong (HKU) and a Bachelor’s degree in Computer Science from Guilin University of Electronic Technology (GUET).

Access the On-Demand Webinar

Connect with us on LinkedIn

Benefits of Press-Fit Solderless Interconnects in Automotive Applications

Key Benefits Include:

  • Reliability & Durability: Withstand harsh automotive environments like vibration, temperature shifts, moisture, and chemicals.
  • Consistent Contact: Mechanical pin design ensures stable electrical connections over time.
  • Superior to Soldering: Avoids cold joints and weak connections- offers up to 10x more reliability than solder or IDC, per IEC61709 standards.

Lamination is now preferred due to its thinner profile, closer tolerances, and scalability. Hot lamination involves more steps and costs, while cold lamination is faster and cost-effective.

ENNOVI offers plastic tray, hot, and cold lamination solutions, with extensive research into cold adhesive alternatives to enhance efficiency, shorten development cycles, and accelerate time-to-market.

Read More
THE COMPANY
TECHNICAL

Stay up to date on all the latest ENNOVI news.