Modern electric vehicle architectures rely on electronic control units (ECUs) to manage critical functions such as steering, braking, and infotainment systems. Engineers face the challenge of stacking multiple circuit boards tightly while avoiding the quality problems associated with traditional solder, such as cold spots, voids, splatter, and cracks. Advanced multi-row board-to-board connectors serve as a key solution for high-density, solderless interconnections in these safety-critical automotive systems.
How does modular snap-in technology facilitate stacking?
Advanced connectors like the ENNOVI-MB2B utilize a proprietary modular snap-in biscuit design. This technology allows multiple connector units to be physically snapped together without the need for solder. This highly adaptable design supports flexible board-to-board stacking heights ranging from 7mm to 30mm.
What is the role of Press-Fit interfaces in solderless connections?
Instead of solder, these connectors employ compliant eye-of-the-needle Press-Fit technology to create electrical pathways. The Press-Fit zone provides a high normal force interface that ensures a strong, repeatable, and highly reliable solder-free connection. This mechanical interface completely removes the risks of cold joints, solder voids, and splatter while simplifying the overall assembly process.
How is high reliability maintained in extreme automotive conditions?
Electric vehicles subject internal electronics to severe shocks and vibrations. The solderless Press-Fit design features a high normal force interface that enables movement to accommodate coefficient of thermal expansion (CTE) mismatches. This robust design allows the connector to withstand extreme automotive conditions and maintain performance across a working temperature range of -40°C to +150°C.
How does this design support dense ECU packaging?
High-density signaling is achieved by supporting flexible configurations of 1 to 6 rows, with 4 to 30 circuits incorporated in each row. The ultra-small footprint of these connectors conserves valuable PCB space while delivering high power density in high-voltage applications. Featuring patented 0.4mm miniPLX™ press-fit terminals, the connectors offer low contact resistance and 3A current-carrying capability per pin, supporting reliable performance in compact, high-density designs. The combination of high pin density and high layout flexibility enables the creation of smaller, highly adaptable, and robust control modules.
Get support for your ECU design needs
Advanced multi-row board-to-board connectors are highly adaptable and essential for achieving reliable, solderless stacking in next-generation EV electronics. By integrating modular snap-in designs with Press-Fit technology, manufacturers can enhance system durability and deliver a cost-effective assembly.
Contact ENNOVI today to learn more about our ENNOVI-MB2B solutions.