Resources

>

Technical Briefs

>

Signal

>

How can manufacturers mitigate the risk of tin whiskering in EV radar sensor interconnects?

DIRECT ANSWER

Manufacturers can mitigate tin whiskering risks in EV radar interconnects by utilizing solder-free press-fit assembly pins and applying specialized whisker-mitigating plating chemistries like IndiCoat™ to replace or supplement traditional tin-based finishes.

Integrating advanced driver assistance systems (ADAS) with Electronic Control Units (ECUs) is a pivotal step in advancing autonomous vehicles. This integration enhances road safety and automation. For these systems, reliable sensor connectivity is required.

Integrated with solder-free ENNOVI Press-Fit Technology, automotive-approved Radar Interconnects are tough, compact, and cost-effective. To mitigate whiskering, they come with the option for IndiCoat™, a whisker mitigating plating chemistry developed to supplement or replace existing tin-based chemistry.

How does solder-free assembly reduce whiskering risks?

Utilizing patented ENNOVI Press-Fit Technology provides an excellent alternative for creating reliable electro-mechanical interconnects without the need for solder. ENNOVI Press-Fit components offer highly repeatable, RoHS-compliant solderless assembly, and they avoid quality problems associated with solder, such as cold spots, voids, splatter, and cracks. To mitigate whiskering, these components come with the option for IndiCoat™, a whisker mitigation electroplating technology.

Patented ENNOVI Press-Fit Technology is a solderless interconnect system validated in high-stress, high-temperature applications. Integrated with solder-free ENNOVI Press-Fit Technology, Radar Interconnects are tough, compact, and cost-effective.

What role does specialized plating play in whisker mitigation?

ENNOVI offers IndiCoat™ whisker mitigation electroplating technology as a finishing option for all Press-Fit components. Specifically, IndiCoat™ was developed as a whisker mitigating plating chemistry to supplement or replace existing tin-based chemistry. To mitigate whiskering, radar interconnects come with the option for IndiCoat™, a whisker mitigation plating technology.

What are the technical properties of whisker-mitigating finishes?

Effective mitigation coatings like IndiCoat™ provide a uniform satin-matte finish that has low friction, alongside excellent electrical and thermal conductivity. Additionally, these specialized finishes feature a low melting point and form strong welding with many metals and alloys. By leveraging these advanced technical properties, the plating delivers a stable and predictable surface that supports the performance and longevity of sensitive radar circuitry.

How can comprehensive sensor protection be achieved?

To mitigate whiskering, ENNOVI Radar Interconnects come with the option for IndiCoat™, a whisker mitigation plating technology. ENNOVI Radar Interconnect houses and protects radar sensors from heat issues, electromagnetic interference, vibration, and shock. A protective housing makes ENNOVI Radar Interconnects.

Drive the Future with Unprecedented Reliability

To mitigate whiskering, radar interconnects come with the option for IndiCoat™, a whisker mitigation plating technology. Integrated with solder-free ENNOVI Press-Fit Technology, our automotive-approved Radar Interconnects are tough, compact, and cost-effective.

Contact ENNOVI today to discover how our custom interconnect solutions can support your high-performance sensor requirements.

Have a specific project in mind?

Our application engineers work on BTS and BTP programmes across global EV OEM and Tier-1 projects. Tell us your pack architecture and current profile and we’ll recommend the right bus bar approach.

DOWNLOAD

Bus Bar Selection Guide

ENNOVI’s full material selection guide for HV bus bars — Al, Cu, laminated, and flexible options with specification data.

Coming Soon

HAVE A SPECIFIC PROJECT?

Speak to an Application Engineer

Our engineers work on BTS and BTP projects across global EV OEM and Tier-1 programmes

Brief details

Portfolio

Signal

Products

ENNOVI-Net (Automotive Ethernet),
ENNOVI-MB2B (Board-to-Board),
High-Pin-Count Headers,
Radar Interconnect,
LiDAR Interconnect,
Press-Fit (EON/miniEON),
MSiB (Modular Snap-in Biscuit)

Buyer stage

Performance Optimization

Author

ENNOVI

Last updated

June 2026

Other engineers also read

Continue exploring Power and Energy technical briefs

Signal

How does Insulation Displacement Contact (IDC) technology simplify magnet wire connections in EV motors?

7 min

Signal

What is the primary manufacturing advantage of using components with pre-applied solder and flux in high-volume EV electronic assemblies?

7 min

Signal

How do advanced radar interconnects protect EV ADAS sensors from electromagnetic interference (EMI)?

7 min

Signal

Why is press-fit technology considered more reliable than traditional soldering for electric vehicle (EV) interconnects?

7 min

Discover ENNOVI Technical Lens

Explore engineering insights, technical perspectives, and practical solutions across Battery Interconnects, Power, and Signal applications.

Before using this website, please read and accept our Terms of Use and Privacy Notice.