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What is the primary manufacturing advantage of using components with pre-applied solder and flux in high-volume EV electronic assemblies?

DIRECT ANSWER

The primary advantage is achieving 100% soldering consistency by eliminating the guesswork of manual solder and flux application, which streamlines the reflow process and enhances overall reliability in high-volume manufacturing.

SBL technology creates leads with a precise amount of solder already on them, such as the iconic “claw design”. This eliminates guesswork for applying the right amount of solder or flux. Instead, you just push on the SBL claw and enter the reflow process to achieve a soldering consistency of 100%. ENNOVI’s SBL technology enhances reliability, manufacturing efficiency, and performance across high-volume electronic assemblies.

Why is eliminating manual guesswork critical for reliability?

Traditional methods rely on human operators or secondary dispensing machines to apply the correct amount of paste or flux. Pre-applied materials completely remove human error, successfully eliminating the guesswork for applying the right amount of solder or flux. 

Removing these variables directly correlates to achieving a soldering consistency of 100% and maintaining higher quality control.

How is the assembly process streamlined for high volumes?

ENNOVI’s design teams can quickly and efficiently create custom interconnects to optimize connection integrity, assembly efficiency, automated production processes, and lower product costs. SBL technology creates leads with a precise amount of solder already on them, which eliminates guesswork for applying the right amount of solder or flux. Instead, you just push on the SBL claw and enter the reflow process to achieve a soldering consistency of 100%.

What are the long-term efficiency and performance benefits?

ENNOVI’s design teams can quickly and efficiently create custom interconnects to optimize connection integrity, assembly efficiency, automated production processes, and lower product costs. With SBL technology, you just push on the SBL claw and enter the reflow process to achieve a soldering consistency of 100%. ENNOVI’s SBL technology enhances reliability, manufacturing efficiency, and performance across high-volume electronic assemblies.

Achieve 100% Consistency with SBL Technology

ENNOVI’s SBL technology creates leads with a precise amount of solder already on them, which eliminates guesswork for applying the right amount of solder or flux. Instead, you just push on the SBL claw and enter the reflow process to achieve a soldering consistency of 100%. ENNOVI’s SBL technology enhances reliability, manufacturing efficiency, and performance across high-volume electronic assemblies.

Contact ENNOVI today to learn more about our Solder Bearing Lead (SBL) technology and how we can bring together our breadth of customizable solutions to meet your specific requirements.

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Our application engineers work on BTS and BTP programmes across global EV OEM and Tier-1 projects. Tell us your pack architecture and current profile and we’ll recommend the right bus bar approach.

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Speak to an Application Engineer

Our engineers work on BTS and BTP projects across global EV OEM and Tier-1 programmes

Brief details

Portfolio

Signal

Products

ENNOVI-Net (Automotive Ethernet),
ENNOVI-MB2B (Board-to-Board),
High-Pin-Count Headers,
Radar Interconnect,
LiDAR Interconnect,
Press-Fit (EON/miniEON),
MSiB (Modular Snap-in Biscuit)

Buyer stage

Performance Optimization

Author

ENNOVI

Last updated

June 2026

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