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Why is press-fit technology considered more reliable than traditional soldering for electric vehicle (EV) interconnects?

DIRECT ANSWER

Press-fit technology is considered more reliable because it creates a strong, solder-free connection with consistent contact force, eliminating common soldering defects like cold spots, voids, and cracks while accommodating thermal expansion in high-stress EV environments.

Electric vehicles operate in rugged automotive environments that subject components to high stress and high temperatures. Traditional soldering can struggle to maintain long-term integrity here, bringing an increased risk of poor connections. 

Press-Fit technology serves as a robust mechanical alternative to standard electro-mechanical interconnects, designed to deliver long-lasting performance in these rugged automotive environments.

How does it eliminate common soldering defects?

Press-Fit creates a solderless assembly that entirely avoids the quality problems associated with solder. By removing the need to melt metals, it eliminates common issues such as cold spots, splatter, voids, and solder cracks. This purely mechanical, solder-free connection simplifies production processes and inherently brings a lower risk of manufacturing errors.

Why is it better at handling thermal expansion?

In high-stress, high-temperature applications, Press-Fit pins feature a high normal force interface that enables movement to accommodate Coefficient of Thermal Expansion (CTE) mismatch. This provides excellent performance during high-temperature cycling conditions and maintains a strong, repeatable, and highly reliable solder-free interface, avoiding the quality problems associated with solder, such as cold spots, voids, splatter, and cracks.

What do industry standards say about Press-Fit reliability?

Leading industry standards provide clear, data-driven validation for this technology. Patented ENNOVI Press-Fit Technology is validated to meet IEC 60352-5 and IPC-9797 standards specifically for high-stress, high-temperature applications. Furthermore, the IEC61709 standard rates Press-Fit with up to 10 times greater reliability compared to traditional connections.

How does it reduce manufacturing and assembly errors?

Solder-free assembly simplifies production processes and brings a lower risk of errors. ENNOVI Press-Fit components offer highly repeatable, RoHS-compliant solderless assembly. By providing consistent contact force, Press-Fit reduces the risk of cold joints or poor connections that can occur with soldering.

Powering the Future: Secure Your EV Networks with Press-Fit

Press-Fit technology provides a superior, more durable foundation for the complex electrical networks within modern EVs. By choosing solderless interconnects, manufacturers can ensure their vehicles withstand the high-stress, high-temperature, and high-vibration realities of the road. 

Contact ENNOVI today to learn more about our Press-Fit solutions and how we can enhance the reliability of your next EV project.

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Brief details

Portfolio

Signal

Products

ENNOVI-Net (Automotive Ethernet),
ENNOVI-MB2B (Board-to-Board),
High-Pin-Count Headers,
Radar Interconnect,
LiDAR Interconnect,
Press-Fit (EON/miniEON),
MSiB (Modular Snap-in Biscuit)

Buyer stage

Performance Optimization

Author

ENNOVI

Last updated

June 2026

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