Radar Interconnect

ENNOVI Radar Interconnect houses and protects radar sensors from heat issues, electro-magnetic interference, vibration and shock.

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Easy assembly. Tough protection.

Integrated with solder-free ENNOVI Press-Fit Technology, our automotive-approved Radar Interconnects are tough, compact and cost-effective. And to mitigate whiskering, they come with the option for IndiCoatâ„¢, our whisker mitigation plating technology.

Reliably resistant

A protective housing makes ENNOVI radar interconnects resistant to EMI. And, with our physical vapor deposition (PVD) coating, offers further protection.

Press-fit for purpose

ENNOVI radar interconnects are made with Press-Fit assembly pins compliant to automotive standards.

Solder-free. Hassle-free.

Designed for compact and cost-effectiveness, ENNOVI radar interconnects are ready to press-on, with solder-free connections.

Eliminates interference.

ENNOVI radar interconnects are robust and pluggable eliminating electromagnetic interference. Ideal for sensitive applications, their conductivity enhances the reliability of on-board radar systems.

How it works

  1. Radome
  2. EMI shielding
  3. Membrane
  4. 0.4 EON/0.64 EON Press-Fit pins
  5. Main housing with UV glue potting at the terminal area​

Applications

Like all ENNOVI components, Radar Interconnect is suitable for EV applications. It integrates seamlessly into an organized system and can be customized to your specifications.
Long-range radar sensor, mid-range radar sensor, short-range radar sensor

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Sustainably does it.

We believe sustainability is everyone’s responsibility. That’s why we are committed to reducing our environmental impact across all our manufacturing plants worldwide.

Discover more about how we are putting our dedication to responsible manufacturing into action.

Join Our Upcoming Webinar!

Topic: Overcome Design Challenges in Busbars for Hybrid and EV Vehicles

Date: 7 February 2025

Time: 10:00 AM ET

Key Takeaways:

  • Prepare for the rise of BEVs, projected to dominate 44% of the automotive market by 2031.
  • Develop busbar solutions to meet high-voltage and lightweight design needs.
  • Enhance efficiency with tailored interconnect and precision manufacturing techniques.